IBL was the first to introduce the single fluid vapor phase soldering process. The use of only one heat transfer fluid combined new process flexibility with reduced fluid consumption, drastically reducing the running cost of vapor phase systems.
This process is the basis of every modern vapor phase soldering system on the market today.

IBL provides its customers with the patented
Soft Vapour Phase (SVP) Technology an unrivaled effective tool for easy creation of any temperature profile, even plateau profiles. A Linear profile has limitations but the additional flexibility to adjust the soldering process is an invaluable advantage, especially when processing complex boards.

IBL offers the Multi-Level control system that is a reliable method of switching between lead and lead-free applications without the need to change the fluid. This procedure enables the user to reliably change solder reflow temperatures without changing fluids. Eliminating the need to change fluids reduces machine set-up time and consequently increases machine availability; hence, machine throughput is increased.

IBL combines vacuum and vapor, offering the user low process temperatures with an efficient vacuum process, and were the first to apply vacuum whilst the solder module is actually in the vapor phase chamber. The advantage of this is lower process temperatures, as the soldering process is not interrupted during evacuation or while moving to a vacuum chamber. Void-free solder joints and smooth temperature profiles are the main benefits of this patented procedure that was developed in co-operation with the Fraunhofer Institute IZM.