PREMIUM | CX800 / CX600

Mr Big
- Highest precision and process quality with patented
Soft Vapour Phase (SVP) Technology
- Maximum throughput in Double Soft Vapour
Inline operation
- Board Sizes up to 800 x 650 x 80 mm
- Low energy and fluid consumption with 3-chamber
design and integrated heat exchanger
- Low maintenance due to Cool Handling
(all moving parts outside process chamber)
- Small footprint
- Easy operation due to soldering automatic and
patented process
- Easy touch screen control
- Patented IR preheating ideal also for glue
hardening and for additional performance
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