The best soldering method achieving gentle heating and optimum quality.
All soldering processes have one thing in common:
They are able to securely attach components onto specified base material.
But for greater process accuracy, higher quality solder joints, consistently repeateble heating, lower reflow costs,
Vapour Phase Soldering, also known as condensation soldering, or vapour phase reflow, is the most flexible, simplest and most reliable reflow soldering method..
It is ideally suited for all types of SMD components and base materials. It allows processing of all components without elaborate setup and without temperature profiling.

Basic configuration
A chemically inert fluid is used for the heat transfer.
This fluid is non-corrosive, electrically non-conductive and does not deteriorate over time.
The boiling point is very accurate depending on the application, most fluids have boiling points between 200°C up to 235°C.
Other temperatures are also available.

Process
As soon as the fluid starts to evaporate, a layer of saturated vapour and condensing fluid covers the soldering area creating an inert (oxygen-free) atmosphere.
The vapour's weight is greater than the surrounding air and forms a protective gas atmosphere (0 ppm oxygen) without the need for any additional gases (nitrogen).
As soon as the solder material is immersed into the vapour zone, the vapour condenses on the solder material and transfers its heat.
Irrespective of the time the solder material remains in the vapour its temperature can never exceed the defined maximum vapour temperature.

As a result, the solder process can be reliably reproduced and offers ideal pre-conditions for a reliable and repeatable process control.
The vapour phase soldering process achieves perfect results on a wide range of assemblies, from flexibles to multi-layers, reliable and without overheating..